Madhavan SWAMINATHAN

Miniaturization of Planar EBG Structure Formed in Power/Ground Plane of Printed Circuit Board to Suppress EMI and Electromagnetic Noise
Yoshitaka TOYOTA  Arif Ege ENGIN  Madhavan SWAMINATHAN  Kengo IOKIBE  Ryuji KOGA 
Publication:   B - Abstracts of IEICE TRANSACTIONS on Communications (Japanese Edition)
Publication Date: 2007/11/01
Vol. J90-B  No. 11  pp. 1135-1142
Type of Manuscript: Special Section PAPER (Special Section on Broadband EMC Technologies)
Category: 
Keyword: 
planar EBG (Electromagnetic bandgap),  printed circuit board (PCB),  power/ground plane,  electromagnetic interference (EMI),  miniaturization, 
  Summary |  Full Text(in Japanese):PDF (876.4KB)
Investigation of Electromagnetic Interference Mechanisms for Mixed-Signal System-On-Package (SOP)
Hideki SASAKI  Vinu GOVIND  Kishna SRINIVASAN  Sidharth DALMIA  Venky SUNDARAM  Madhavan SWAMINATHAN  Rao TUMMALA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2006/11/01
Vol. J89-C  No. 11  pp. 874-884
Type of Manuscript: Special Section PAPER (Special Issue on Advanced Packaging and Electromagnetic Noise Reduction Technology for Next Generation Electronic Systems)
Category: 
Keyword: 
mixed-signal,  system-on-package,  electromagnetic interference,  embedded passives, 
  Summary |  Full Text(in Japanese):PDF (2.1MB)