Li-Chung HSU


A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel
Li-Chung HSU Junichiro KADOMOTO So HASEGAWA Atsutake KOSUGE Yasuhiro TAKE Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2015/12/01
Vol. E98-A  No. 12  pp. 2584-2591
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Design
Keyword: 
TCIThruChip3-D ICTSVinductive coupling interface
 Summary | Full Text:PDF(6.3MB)

Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration
Li-Chung HSU Masato MOTOMURA Yasuhiro TAKE Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2015/04/01
Vol. E98-C  No. 4  pp. 288-297
Type of Manuscript:  Special Section PAPER (Special Section on Solid-State Circuit Design---Architecture, Circuit, Device and Design Methodology)
Category: 
Keyword: 
TCIThruChip3-D FPGATSVFPGATPRVPR
 Summary | Full Text:PDF(2.7MB)

On Reducing Test Power, Volume and Routing Cost by Chain Reordering and Test Compression Techniques
Chia-Yi LIN Li-Chung HSU Hung-Ming CHEN 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2010/03/01
Vol. E93-C  No. 3  pp. 369-378
Type of Manuscript:  Special Section PAPER (Special Section on Circuits and Design Techniques for Advanced Large Scale Integration)
Category: 
Keyword: 
DFTTSPtest power
 Summary | Full Text:PDF(751.6KB)