Keiji MATSUMOTO

Reliability of Microbumps Interconnect for 3D TSV Chip Stacking
Yasumitsu ORII  Katsuyuki SAKUMA  Kuniaki SUEOKA  Sayuri KOHARA  Kazushige TORIYAMA  Keiji MATSUMOTO  Hirokazu NOMA  Keishi OKAMOTO  Toyohiro AOKI 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2011/11/01
Vol. J94-C  No. 11  pp. 402-410
Type of Manuscript: Special Section PAPER (Special Issue on High-speed & High-density Packaging and Integration Technologies for Microelectronic Devices)
Category: 
Keyword: 
IMC bonding,  CPI (Chip Package Interaction),  flip chip,  chip stack, 
  Summary |  Full Text(in Japanese):PDF (1.9MB)
On a Scattering Field Expression by Dielectric Diffraction Gratings Using Shadow Theory
Hideaki WAKABAYASHI  Masamitsu ASAI  Keiji MATSUMOTO  Jiro YAMAKITA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2010/03/01
Vol. J93-C  No. 3  pp. 81-90
Type of Manuscript: PAPER
Category: 
Keyword: 
periodic structure,  dielectric grating,  shadow theory,  scattering factor,  matrix eigenvalue problem, 
  Summary |  Full Text(in Japanese):PDF (389.8KB)
Entanglement and Quantum Information Processing
Keiji MATSUMOTO 
Publication:   A - Abstracts of IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences (Japanese Edition)
Publication Date: 2007/05/01
Vol. J90-A  No. 5  pp. 340-347
Type of Manuscript: Special Section PAPER (Special Section on Quantum Information Processing)
Category: 
Keyword: 
entanglement,  non-locality,  Bell's inequality,  quantum information, 
  Summary |  Full Text(in Japanese):PDF (167KB)