Publication: C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2011/11/01
Vol. J94-C
No. 11
pp. 402-410
Type of Manuscript: Special Section PAPER (Special Issue on High-speed & High-density Packaging and Integration Technologies for Microelectronic Devices)
Category:
Keyword:
IMC bonding,
CPI (Chip Package Interaction),
flip chip,
chip stack,
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