Kazuaki TAKAHASHI


A 60 GHz CMOS Transceiver IC for a Short-Range Wireless System with Amplitude/Phase Imbalance Cancellation Technique
Koji TAKINAMI  Junji SATO  Takahiro SHIMA  Mitsuhiro IWAMOTO  Taiji AKIZUKI  Masashi KOBAYASHI  Masaki KANEMARU  Yohei MORISHITA  Ryo KITAMURA  Takayuki TSUKIZAWA  Koichi MIZUNO  Noriaki SAITO  Kazuaki TAKAHASHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/10/01
Vol. E95-C  No. 10  pp. 1598-1609
Type of Manuscript: Special Section PAPER (Special Section on Recent Progress in Microwave and Millimeter-Wave Technologies)
Category: 
Keyword: 
CMOSmillimeter-wavedirect conversionamplitude/phase imbalancephase locked loop (PLL)injection locked frequency dividercalibrationpush-push voltage controlled oscillator60 GHz
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Performance Evaluation of Transmission Technique Utilizing Linear Combination Diversity in MIMO Spatial Multiplexing Systems
Yutaka MURAKAMI  Takashi MATSUOKA  Kazuaki TAKAHASHI  Masayuki ORIHASHI 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2008/05/01
Vol. E91-B  No. 5  pp. 1511-1520
Type of Manuscript: PAPER
Category: Wireless Communication Technologies
Keyword: 
MIMO systemLC-diversityNLOS/LOS environmentsBER performancediversity gain
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Design of Transmission Technique Utilizing Linear Combination Diversity in Consideration of LOS Environments in MIMO Systems
Yutaka MURAKAMI  Kiyotaka KOBAYASHI  Takashi MATSUOKA  Kazuaki TAKAHASHI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2005/11/01
Vol. E88-A  No. 11  pp. 3127-3133
Type of Manuscript: Special Section LETTER (Special Section on Wide Band Systems)
Category: 
Keyword: 
MIMOLC-diversityLOS environments
  Summary |  Full Text:PDF (937.7KB)

Millimeter-Wave Wireless-LAN System Employing Compact and Cost-Effective 156 Mbps Transceiver MCMs
Kazuaki TAKAHASHI  Suguru FUJITA  Hiroyuki YABUKI  Masugi INOUE  Gang WU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2003/08/01
Vol. E86-C  No. 8  pp. 1512-1519
Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter Wave Technology)
Category: 
Keyword: 
wireless LANmillimeter-wavemulti chip moduleDROMSK
  Summary |  Full Text:PDF (1.6MB)

A Compact V-Band Filter/Antenna Integrated Receiver IC Built on Si-Micromachined BCB Suspended Structure
Kazuaki TAKAHASHI  Ushio SANGAWA  Suguru FUJITA  Michiaki MATSUO  Takeharu URABE  Hiroshi OGURA  Hiroyuki YABUKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/10/01
Vol. E84-C  No. 10  pp. 1506-1514
Type of Manuscript: Special Section PAPER (Special Issue on Millimeter-Wave Circuits and Fabrication Technologies Opening up the 21st Century)
Category: 
Keyword: 
micromachiningsuspended linebenzocyclobutenefilterantenna
  Summary |  Full Text:PDF (1.8MB)

Miniaturized Millimeter-Wave Hybrid IC Technology Using Non-Photosensitive Multi-Layered BCB Thin Films and Stud Bump Bonding
Kazuaki TAKAHASHI  Hiroshi OGURA  Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/20
Vol. E82-C  No. 11  pp. 2029-2037
Type of Manuscript: INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
millimeter waveflip-chip bondingstud bumpmicro bumpBCBmulti-layer
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Development of K-Band Front-End Devices for Broadband Wireless Communication Systems Using Millimeter-Wave Flip-Chip IC Technology
Kazuaki TAKAHASHI  Suguru FUJITA  Hiroyuki YABUKI  Takayuki YOSHIDA  Yoshito IKEDA  Hiroyuki SAKAI  Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/20
Vol. E81-C  No. 6  pp. 827-833
Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword: 
flip-chipmicro bump bondingmillimeter-waveHFETHBT
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A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology
Hiroyuki SAKAI  Yorito OTA  Kaoru INOUE  Takayuki YOSHIDA  Kazuaki TAKAHASHI  Suguru FUJITA  Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/08/20
Vol. E78-C  No. 8  pp. 971-978
Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology)
Category: 
Keyword: 
millimeter-waveflip-chipIC (Integrated Circuit)microstrip linebump
  Summary |  Full Text:PDF (1MB)

Low-Power Technology for GaAs Front-End ICs
Tadayoshi NAKATSUKA  Junji ITOH  Kazuaki TAKAHASHI  Hiroyuki SAKAI  Makoto TAKEMOTO  Shinji YAMAMOTO  Kazuhisa FUJIMOTO  Morikazu SAGAWA  Osamu ISHIKAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/04/20
Vol. E78-C  No. 4  pp. 430-435
Type of Manuscript: Special Section PAPER (Special Issue on Low-Voltage, Low-Power Integrated Circuits)
Category: Analog Circuits
Keyword: 
mobile communicationfront-enddown-converterup-converterGaAs IChybrid IClow-power consumption
  Summary |  Full Text:PDF (687.6KB)