Kazuaki TAKAHASHI


Millimeter-Wave Wireless LAN and Its Extension toward 5G Heterogeneous Networks
Kei SAKAGUCHI Ehab Mahmoud MOHAMED Hideyuki KUSANO Makoto MIZUKAMI Shinichi MIYAMOTO Roya E. REZAGAH Koji TAKINAMI Kazuaki TAKAHASHI Naganori SHIRAKATA Hailan PENG Toshiaki YAMAMOTO Shinobu NANBA 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2015/10/01
Vol. E98-B  No. 10  pp. 1932-1948
Type of Manuscript:  INVITED PAPER (Special Section on 5G Radio Access Networks―Part II: Multi-RAT Heterogeneous Networks and Smart Radio Technologies)
Category: 
Keyword: 
millimeter waveIEEE802.11adcoordinated mmw WLAN5G cellular networksheterogeneous networks
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A 60 GHz CMOS Transceiver IC for a Short-Range Wireless System with Amplitude/Phase Imbalance Cancellation Technique
Koji TAKINAMI Junji SATO Takahiro SHIMA Mitsuhiro IWAMOTO Taiji AKIZUKI Masashi KOBAYASHI Masaki KANEMARU Yohei MORISHITA Ryo KITAMURA Takayuki TSUKIZAWA Koichi MIZUNO Noriaki SAITO Kazuaki TAKAHASHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/10/01
Vol. E95-C  No. 10  pp. 1598-1609
Type of Manuscript:  Special Section PAPER (Special Section on Recent Progress in Microwave and Millimeter-Wave Technologies)
Category: 
Keyword: 
CMOSmillimeter-wavedirect conversionamplitude/phase imbalancephase locked loop (PLL)injection locked frequency dividercalibrationpush-push voltage controlled oscillator60 GHz
 Summary | Full Text:PDF(5.5MB)

Performance Evaluation of Transmission Technique Utilizing Linear Combination Diversity in MIMO Spatial Multiplexing Systems
Yutaka MURAKAMI Takashi MATSUOKA Kazuaki TAKAHASHI Masayuki ORIHASHI 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2008/05/01
Vol. E91-B  No. 5  pp. 1511-1520
Type of Manuscript:  PAPER
Category: Wireless Communication Technologies
Keyword: 
MIMO systemLC-diversityNLOS/LOS environmentsBER performancediversity gain
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Design of Transmission Technique Utilizing Linear Combination Diversity in Consideration of LOS Environments in MIMO Systems
Yutaka MURAKAMI Kiyotaka KOBAYASHI Takashi MATSUOKA Kazuaki TAKAHASHI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2005/11/01
Vol. E88-A  No. 11  pp. 3127-3133
Type of Manuscript:  Special Section LETTER (Special Section on Wide Band Systems)
Category: 
Keyword: 
MIMOLC-diversityLOS environments
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Millimeter-Wave Wireless-LAN System Employing Compact and Cost-Effective 156 Mbps Transceiver MCMs
Kazuaki TAKAHASHI Suguru FUJITA Hiroyuki YABUKI Masugi INOUE Gang WU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2003/08/01
Vol. E86-C  No. 8  pp. 1512-1519
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter Wave Technology)
Category: 
Keyword: 
wireless LANmillimeter-wavemulti chip moduleDROMSK
 Summary | Full Text:PDF(1.6MB)

A Compact V-Band Filter/Antenna Integrated Receiver IC Built on Si-Micromachined BCB Suspended Structure
Kazuaki TAKAHASHI Ushio SANGAWA Suguru FUJITA Michiaki MATSUO Takeharu URABE Hiroshi OGURA Hiroyuki YABUKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/10/01
Vol. E84-C  No. 10  pp. 1506-1514
Type of Manuscript:  Special Section PAPER (Special Issue on Millimeter-Wave Circuits and Fabrication Technologies Opening up the 21st Century)
Category: 
Keyword: 
micromachiningsuspended linebenzocyclobutenefilterantenna
 Summary | Full Text:PDF(1.8MB)

Miniaturized Millimeter-Wave Hybrid IC Technology Using Non-Photosensitive Multi-Layered BCB Thin Films and Stud Bump Bonding
Kazuaki TAKAHASHI Hiroshi OGURA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11  pp. 2029-2037
Type of Manuscript:  INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
millimeter waveflip-chip bondingstud bumpmicro bumpBCBmulti-layer
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Development of K-Band Front-End Devices for Broadband Wireless Communication Systems Using Millimeter-Wave Flip-Chip IC Technology
Kazuaki TAKAHASHI Suguru FUJITA Hiroyuki YABUKI Takayuki YOSHIDA Yoshito IKEDA Hiroyuki SAKAI Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C  No. 6  pp. 827-833
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword: 
flip-chipmicro bump bondingmillimeter-waveHFETHBT
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A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology
Hiroyuki SAKAI Yorito OTA Kaoru INOUE Takayuki YOSHIDA Kazuaki TAKAHASHI Suguru FUJITA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/08/25
Vol. E78-C  No. 8  pp. 971-978
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology)
Category: 
Keyword: 
millimeter-waveflip-chipIC (Integrated Circuit)microstrip linebump
 Summary | Full Text:PDF(1MB)

Low-Power Technology for GaAs Front-End ICs
Tadayoshi NAKATSUKA Junji ITOH Kazuaki TAKAHASHI Hiroyuki SAKAI Makoto TAKEMOTO Shinji YAMAMOTO Kazuhisa FUJIMOTO Morikazu SAGAWA Osamu ISHIKAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/04/25
Vol. E78-C  No. 4  pp. 430-435
Type of Manuscript:  Special Section PAPER (Special Issue on Low-Voltage, Low-Power Integrated Circuits)
Category: Analog Circuits
Keyword: 
mobile communicationfront-enddown-converterup-converterGaAs IChybrid IClow-power consumption
 Summary | Full Text:PDF(686.3KB)