Katsuyuki SAKUMA

Hybrid Solder-Adhesive Bonding and Surface Treatment Techniques for 3D LSI
Masatsugu NIMURA  Katsuyuki SAKUMA  Shuichi SHOJI  Jun MIZUNO 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2012/11/01
Vol. J95-C  No. 11  pp. 296-303
Type of Manuscript: Special Section PAPER (Special Issue on Advanced Material Technological for High-Density Packaging and Hetero Integration)
Category: 
Keyword: 
3D LSI,  bonding,  underfill,  fluxless,  hydrogen radical, 
  Summary |  Full Text(in Japanese):PDF (1.7MB)
Reliability of Microbumps Interconnect for 3D TSV Chip Stacking
Yasumitsu ORII  Katsuyuki SAKUMA  Kuniaki SUEOKA  Sayuri KOHARA  Kazushige TORIYAMA  Keiji MATSUMOTO  Hirokazu NOMA  Keishi OKAMOTO  Toyohiro AOKI 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2011/11/01
Vol. J94-C  No. 11  pp. 402-410
Type of Manuscript: Special Section PAPER (Special Issue on High-speed & High-density Packaging and Integration Technologies for Microelectronic Devices)
Category: 
Keyword: 
IMC bonding,  CPI (Chip Package Interaction),  flip chip,  chip stack, 
  Summary |  Full Text(in Japanese):PDF (1.9MB)