Katsuyuki MACHIDA

Integrated CMOS-MEMS Technology and Its Applications
Hiroki MORIMURA  Toshishige SHIMAMURA  Kei KUWABARA  Kazuyoshi ONO  Katsuyuki MACHIDA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2012/08/01
Vol. J95-C  No. 8  pp. 175-182
Type of Manuscript: Special Section PAPER (Special Issue on Expectations and Challenges of LSI and High-density Packaging Technology for Heterogeneous Device Integration)
Category: 
Keyword: 
CMOS-MEMS technology,  fingerprint sensor,  multiband-RF,  batteryless senor-node,  energy harvesting, 
  Summary |  Full Text(in Japanese):PDF (1.8MB)
Novel MEMS Packaging Technology with Combining STP and Screen-Print Techniques
Naruto MAYUMI  Mitsuru CHINO  Hiroshi TAZAWA  Toshikazu KAMEI  Katsuyuki MACHIDA  Eiji HIGURASHI 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2010/11/01
Vol. J93-C  No. 11  pp. 503-508
Type of Manuscript: Special Section PAPER (Special Section on Advanced Packaging and Its Related Topics about Evaluation and Analysis Technologies for High-Density Packaging)
Category: 
Keyword: 
MEMS,  protection film,  mount technology,  packaging, 
  Summary |  Full Text(in Japanese):PDF (510.6KB)