Hirokazu EZAWA

Examination of TMV First Process for FO-WLP with Cu Pillar Substrate
Hiroshi YAMADA Akihiko HAPPOYA Shuzo AKEJIMA Hirokazu EZAWA 
Publication:   - - Abstracts of (Japanese Edition)
Publication Date: 2018/02/01
Vol. J101-C  No. 2  pp. 66-73
Type of Manuscript:  Special Section PAPER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Fan out wafer level packageThrough mold viaCu pillarTMV first processresidue of the resin
 Summary | Full Text(in Japanese):PDF(4.3MB)