Hirokazu EZAWA


Examination of TMV First Process for FO-WLP with Cu Pillar Substrate
Hiroshi YAMADA Akihiko HAPPOYA Shuzo AKEJIMA Hirokazu EZAWA 
Publication:   - - Abstracts of (Japanese Edition)
Publication Date: 2018/02/01
Vol. J101-C  No. 2  pp. 66-73
Type of Manuscript:  Special Section PAPER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Category: 
Keyword: 
Fan out wafer level packageThrough mold viaCu pillarTMV first processresidue of the resin
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