Publication: C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2007/11/01
Vol. J90-C
No. 11
pp. 724-733
Type of Manuscript: Special Section PAPER (Special Issue on Next Generation High Density Packaging Materials Technology for High Performance Electric Systems)
Category:
Keyword:
3D-packaging,
through silicon vias,
DRAM,
high-density,
package,
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