Publication: C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2011/11/01
Vol. J94-C
No. 11
pp. 386-393
Type of Manuscript: Special Section PAPER (Special Issue on High-speed & High-density Packaging and Integration Technologies for Microelectronic Devices)
Category:
Keyword:
TSV,
Cu interconnect,
electroless plating,
difussion barrier,
seed layer,
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