Fara ASHIKIN


A Design for Testability of Open Defects at Interconnects in 3D Stacked ICs
Fara ASHIKIN Masaki HASHIZUME Hiroyuki YOTSUYANAGI Shyue-Kung LU Zvi ROTH 
Publication:   
Publication Date: 2018/08/01
Vol. E101-D  No. 8  pp. 2053-2063
Type of Manuscript:  PAPER
Category: Dependable Computing
Keyword: 
3D stacked ICopen defectsdesign-for-testabilitythrough-silicon viaelectrical interconnect test
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