Atsushi IZUMI


Simultaneous Measurement of Residual Stress at Interfaces between Die Bonding Paste Resins and Cu-Substrates, and Resins and Ag-Fillers in Semiconductor Packages
Takeshi KAKARA Atsushi IZUMI Midori WAKABAYASHI Dai NAGASHIMA 
Publication:   - - Abstracts of (Japanese Edition)
Publication Date: 2018/02/01
Vol. J101-C  No. 2  pp. 99-100
Type of Manuscript:  Special Section LETTER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Category: 
Keyword: 
semiconductor packagesinterface residual stresssimultaneous measurementtwo-dimensional detector
 Summary | Full Text(in Japanese):PDF(408.5KB)