Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1993/04/20 Vol. E76-CNo. 4pp. 572-576 Type of Manuscript: Special Section PAPER (Special Issue on Sub-Half Micron Si Device and Process Technologies) Category: Device Technology Keyword: SOI bipolar transistors,
thin buried layer,
wafer bonding,
selective polishing,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1992/12/20 Vol. E75-CNo. 12pp. 1453-1458 Type of Manuscript: Special Section PAPER (Special Issue on SOI (Si on Insulator) Devices) Category: SOI Devices Keyword: bonded SOI,
lateral bipolar,
sidewall self-aligning base,
BiCMOS,
recrystallization,
