Akihiko HAPPOYA


Examination of TMV First Process for FO-WLP with Cu Pillar Substrate
Hiroshi YAMADA Akihiko HAPPOYA Shuzo AKEJIMA Hirokazu EZAWA 
Publication:   - - Abstracts of (Japanese Edition)
Publication Date: 2018/02/01
Vol. J101-C  No. 2  pp. 66-73
Type of Manuscript:  Special Section PAPER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Category: 
Keyword: 
Fan out wafer level packageThrough mold viaCu pillarTMV first processresidue of the resin
 Summary | Full Text(in Japanese):PDF(4.3MB)

Study of Stress to Solder Joint by Underfill Filling
Akira TANAKA Akihiko HAPPOYA Shun OKAYAMA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2011/11/01
Vol. J94-C  No. 11  pp. 419-426
Type of Manuscript:  Special Section PAPER (Special Issue on High-speed & High-density Packaging and Integration Technologies for Microelectronic Devices)
Category: 
Keyword: 
underfillfillersoldernanoindentationYoung's modulus
 Summary | Full Text(in Japanese):PDF(1.7MB)

Development of Full-Stacked Via Printed Wiring Board with High Thermal Reliability
Akihiko HAPPOYA Akira TANAKA Kenji HIROHATA Shun OKAYAMA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2009/11/01
Vol. J92-C  No. 11  pp. 703-711
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Packging and Environmentally Conscious Packaging Technologies in Next-Generation Electronic Equipment)
Category: 
Keyword: 
printed wiring boardthermal stressreliabilitystacked viahalogen-free
 Summary | Full Text(in Japanese):PDF(1.7MB)

Productivity and Reliability of Module Using Substrate with Cavity
Akihiko HAPPOYA Jun KARASAWA Daigo SUZUKI Koji SHINGUU Kenji HIROHATA Shun OKAYAMA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2008/11/01
Vol. J91-C  No. 11  pp. 577-585
Type of Manuscript:  Special Section PAPER (Special Issue on Leading-Edge Trend of Advanced Packages for Electron Devices and Its Related Topics for High-Density Packaging Process Technologies)
Category: 
Keyword: 
cavitysubstratemoduleproductivityreliability
 Summary | Full Text(in Japanese):PDF(1.4MB)