Aibin YAN


A Region-Based Through-Silicon via Repair Method for Clustered Faults
Tianming NI Huaguo LIANG Mu NIE Xiumin XU Aibin YAN Zhengfeng HUANG 
Publication:   
Publication Date: 2017/12/01
Vol. E100-C  No. 12  pp. 1108-1117
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
3D ICsyield enhancementTSV redundancyreparabilityadditional delay overhead
 Summary | Full Text:PDF(1.9MB)

Highly Robust Double Node Upset Resilient Hardened Latch Design
Huaguo LIANG Xin LI Zhengfeng HUANG Aibin YAN Xiumin XU 
Publication:   
Publication Date: 2017/05/01
Vol. E100-C  No. 5  pp. 496-503
Type of Manuscript:  PAPER
Category: Electronic Circuits
Keyword: 
single event double node upsetsingle node upsetresilienceradiation hardened latch
 Summary | Full Text:PDF(959.2KB)

A Self-Recoverable, Frequency-Aware and Cost-Effective Robust Latch Design for Nanoscale CMOS Technology
Aibin YAN Huaguo LIANG Zhengfeng HUANG Cuiyun JIANG Maoxiang YI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2015/12/01
Vol. E98-C  No. 12  pp. 1171-1178
Type of Manuscript:  PAPER
Category: Electronic Circuits
Keyword: 
transient faultsingle event upsetsoft errorradiation hardeningcircuit reliability
 Summary | Full Text:PDF(1.7MB)